Features:

	Implements wear-leveling algorithms to substantially increase longevity of flash media
	Fully compatible with devices and OS, no driver or software needed
	No noise, no latency delay and no seek error
	Compatible with IDE interface
	Shock resistance and anti-vibration
	Robust and rugged design
	Low power consumption
	RoHS Compliant

Specifications:

Model	ADC II		ADC III
Connector	600mil 32-pin DIP connector
Capacities	32MB~4GB		128MB~8GB
Transfer mode	PIO Mode-4 ; MWDMA Mode-2		PIO Mode-4 ; Ultra DMA Mode-4
Sustained Read/Write Performance	11 / 7 (MB/sec)		Up to 35 / 20 (MB/sec)
ECC Support	3 random 12 bit symbol ECC per 512 bytes (RS)		Up to 8 bit correction per 512byte page size (BCH)
Environmental Specification	•Operating Temp.: 0°C ~ + 70°C (Standard) -40°C ~ + 85°C (Extended Temperature) •Storage Temp: -40°C ~ + 100°C •Shock:50G •Vibration: 15G •Humidity: 5% ~ 95% relative, non-condensing
Low Power Consumption (3.3V/5.5V)	•Active mode: 35mA/55mA •Sleep mode: 100µA/150µA		•Active mode (Typical): 80mA/85mA •Sleep mode (Typical): 90µA
MTBF	> 2,000,000 hours		> 2,000,000 hours (Est.)
P/E Cycle	>2,000,000 times
Security Function	•Factory-programmed, up to 20-byte unique ID (Software Protect mechanism) •Protection Zone (Optional)
Certification	CE, EN55022, CISPR22, EN55024, EN6100 FCC, Part 15 Class B, MIL-STD-810F, RoHS
Photo